News for RoseStreet Labs
3701 E. University, Phoenix, Arizona 85034 - 602-431-6020
July 29th, 2008 RoseStreet Labs Energy Announces Joint Photovoltaic Research Program with Los Alamos National Laboratory.
July 8th, 2008, Hermes European Die Consortia Selects FlipChip International's EDC TM (Embeddable Die Customization) Technology
June 16th, 2008, Unisem and FlipChip International Sign Licensing Agreement for Wafer Bumping and Wafer Level Packaging Technologies.
March 17th, 2008 RoseStreet Labs Energy Announces Opening of Full Spectrum Solar Cell Development Center in Phoenix, Arizona.
March 17th, 2008 FlipChip International Announces Official Opening of FABLAB, WLCSP & 3D Packaging Innovation Center.
November 13th, 2007 FlipChip International's EDC Enables Embedded Die Packaging
November 12, 2007 FlipChip International Announces Expansion of DSD Fab to 3 Million Die a Week
August 8, 2007 RoseStreet Energy Announces Pilot Line For Full Spectrum Photovoltaics
August 7, 2007 FlipChip International Appoints Scott T. Barrett as Vice President Asian Business Development
December 20, 2006 FlipChip International Appoints Greg Marshall as Chief Financial Officer
October 26, 2006 RoseStreet Labs & Sumitomo Chemical Announce Joint Venture for Full Spectrum Solar Cells
June 28, 2006 FlipChip International Appoints Ted Tessier as Chief Technical Officer
June 27, 2006 FlipChip International Appoints Jay Grover as Chief Operating Officer
May 23, 2006 FlipChip International and Engent Announce Strategic Alliance to Develop and Deploy 3D Wafer Level CSP Technologies
February 10, 2006 FlipChip International Breaks Ground on China Joint Venture for Wafer Level Packaging with Millennium Microtech Shanghai
January 4, 2006 FlipChip International Appoints Fred Hickman III as VP Sales & Marketing
December 6, 2005 RoseStreet Labs Announces License Agreement with Lawrence Berkeley National Laboratory for Multi-Band Semiconductors and High Efficiency Solar Cells
September 8, 2005 RoseStreet Labs Acquires Breath Acetone Monitoring Technology From The Dow Chemical Company
August 9, 2005 RoseStreet Labs Announces 3D & MEMs Packaging R&D Laboratory and Alliance with SUSS MicroTec
April 28, 2005 ASE and FlipChip International Sign Worldwide Licensing Agreement
April 26, 2005 FlipChip International Introduces EliteCSP Wafer Level Package and License with Fraunhofer Institute for Advanced Low Cost Wafer Bumping
April 20, 2005 FlipChip International and NEC Electronics Sign Cross-Licensing Agreement for Advanced Wafer Level Packaging Technology.
April 19, 2005 RoseStreet Labs Announces Full Spectrum Solar Cell Commercialization Agreement with Cornell University
March 23, 2005 FlipChip International Appoints Terrence M. Lubsen as VP-Quality & Continuous Improvement
Jan 25 , 2005--FlipChip International Announces Successful Completion of Acquisition of Assets of IC Services
Dec. 8, 2004--FlipChip International Announces Agreement to Acquire Assets of IC Services
Dec 1, 2004--FlipChip International Appoints Jay Grover-VP Operations
Oct 11, 2004--FlipChip International Opens Reliability & Design Center
Oct 1, 2004--FlipChip International Receives ISO 9001-2000 Certification
Aug 23, 2004--FlipChip International Demonstrates 95 micron Pitch Bumping Technology for Advanced Semiconductor Devices
July 9, 2004--FlipChip International Announces Expansion of Spheron Wafer Level Packaging Manufacturing Capacity for Wireless and High Speed Applications
June, 2, 2004-- RoseStreet Labs & ASU Announce an Obesity Research & Commercialization Agreement for Dietary Monitors
March 17, 2004---FlipChip International Announces High Volume Lead-Free Bumping and Wafer Scale Packaging Production
March 5, 2004---FlipChip International Appoints Bruce Bowers as Vice President of Operations
February 24, 2004---FLIPCHIP INTERNATIONAL APPOINTS JACK HODGSON AS CHIEF FINANCIAL OFFICER
February 9, 2004---ROSESTREET LABS ANNOUNCES THE ASSET ACQUISITION OF FLIP CHIP TECHNOLOGIES FROM KULICKE AND SOFFA INDUSTRIES AND THE FORMATION OF FLIPCHIP INTERNATIONAL, LLC
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