FlipChip has opened a Center of Excellence for the development of next generation wafer level 3D semiconductor devices in Phoenix, Arizona. The strategic direction of this R&D center is to provide FCI's and RSL's customers with next generation solutions on advanced packaging for a variety of devices from photovoltaics to advanced memory devices. Innovations achieved in the Center will be rolled into our Design for Manufacturing methodology. This FabLab Center of Excellence will provide benefits for our valued customers:

• Competitive Advantage
• Scalability of production/capacity
• Controllable product costs
• IP and Supply Management coupled with technical innovation
• Technology based on FCI's existing process library allowing prequalifed processes.
• Reduced transfer time/cost
• Rapid new product introduction
• Continous process improvement.

Phase 1 of the equipment and tools have been installed to support wafer level technology development and materials characterization. In this phase 150mm and 200mm copper electroplating is in operation and other tool and process capability includes photolithography, wafer to wafer bonding, nano-imprinting and electroless plating. RSL has a full polymer R&D laboratory available on site for development and characterization of next generation dielectrics.

Phase 2 expansion of the FabLab to support 500 wafers a week of high mix, high technology emerging 3D packaging programs is in progress. This expanded tool set includes thin film, production worthy photoresist coating/expose/develop tools, RIE, PECVD and die thinning capability. This phase will enable through silicon vias (TSV's) and other enabling 3D packaging technologies.

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